Temperature field analysis of LED Cooling plate
碩士 === 元智大學 === 機械工程學系 === 99 === As the demand of performance LED components increased and package size decreased, the heat generated more than before. The most popular ways to accelerate the cooling procedure are increase the contact area for cooling and choose the suitable materials. Aluminum...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/47196823727541780474 |