Interfacial reactions of lead-free solders with electroless palladium on the nickel substrate
碩士 === 國立中正大學 === 化學工程研究所 === 100 === With the miniaturization of electronic products, the plating finishing techniques can not conform to the requirement. Therefore, electroless plating finishing techniques play an important in electronic industry. Among finishing techniques, ENEPIG has many advant...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/22944125394377238894 |