Parametric Design of COF-ILB Eutectic Bonding Process by Finite Element Method
碩士 === 國立中正大學 === 機械工程學系暨研究所 === 101 === Pressing temperature, pressing time, bump size, lead size, tin layer composition on lead and bonding force are some process parameter of Flip chip-on-film (FCOF) technique in the manufacturing process of Inner Lead Bonding. These parameters are affect the yie...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44324288990757149931 |