| Summary: | 碩士 === 國立中正大學 === 機械工程學系暨研究所 === 101 === Pressing temperature, pressing time, bump size, lead size, tin layer composition on lead and bonding force are some process parameter of Flip chip-on-film (FCOF) technique in the manufacturing process of Inner Lead Bonding. These parameters are affect the yielding rate and reliability of the product. In general, low yielding rate and low reliability of the process is caused by thermal deformation and the existing of stress / strain behavior, and they will leads different failure modes. Therefore the main purpose of this study is to optimize the manufacturing parameter design, and deformation of the interconnection and the occurrence of heat transfer in bonding process were taken into consideration. In addition, Finite Element Method (FEM) simulation model is developed for the verification of experimental results, and the model is used in further investigation.
The experiment is categorized into three parts. The first part is the temperature measurement of the components in ILB process, and the second part is to measure sinking value and edge gap for different bonding force, the last part is to discuss the offset and several bonding force leading to different sinking value. Part of the results was used to verify of the FEM simulation model. For numerical analysis, the single lead model was built to simulate the heat transfer during bonding process. Then use the simulation model to search the optimization design among bonding force, sinking value and edge gap. The influence of related offset between bump and lead to COF structure also discussed. The results could improve develop of COF-ILB products and provide relevant parameters for ILB design.
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