Wire sweep analysis for the applications of Au,Cu and Pd-coated Cu wire in semiconductor wirebonding technology
碩士 === 正修科技大學 === 機電工程研究所 === 100 === The mainstream of the current package in terconneetion technology in semiconductor industry includes wire bonding and flip chip bonding. In order to meet the portability requirement, more powerful products have been introduced for IC packaging, for example, mul...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/40469588277189907128 |