An Investigation in Temperature Effects with an Improvement Approach of Wafer Probing Test
碩士 === 中原大學 === 電子工程研究所 === 100 === In the testing flow of an advanced process, the testing under high and low temperature has been become a necessary issue for testing. Testing under variables of high and low temperature is often confronted with the problem of low yield ratio, which is caused often...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47731625992344528576 |