Drop Impact Analysis of 3D Stacked Die PBGA Packaging
碩士 === 逢甲大學 === 航太與系統工程所 === 100 === Nowadays, there is an increasing concern on the drop impact reliability of portable devices because drop impact chances due to careless in-stallation and handling are increasing during their life-time usage. Accordingly, improving the shock resistance capability...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44612355675714385669 |