The Key Success Factor Study of Semiconductor Back-end Packaging and Testing Equipment Industry

碩士 === 逢甲大學 === 經營管理碩士在職專班 === 100 === In the recent years, the multi-package equipment industry of the semi-conductor backend process has confronted with the fierce challenge of the operation environmental change and the intense competition. The customer expectation and requirement have been growin...

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Bibliographic Details
Main Authors: Hung-Wei Kuo, 郭鴻韋
Other Authors: none
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/xv8wn8