The effect of pulse plating on stress and grain growth of copper coating
碩士 === 龍華科技大學 === 工程技術研究所 === 100 === This research is the theoretical basis and precise experimental analysis to investigate the impact of the supply mechanism for the coating stress, grain growth and surface morphology. On the experimental side, the use of reverse-pulse current (PR) plating copper...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05703194902988339658 |