Improvement of test yield for IC product

• Main Author: 林大元
• Other Authors: 盧裕溢
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/10278273900914863189

碩士 === 明新科技大學 === 電機工程研究所碩士在職專班 === 100 === Abstract Semiconductor testing plant usually increases tester utilization and reduces overkill to increase profits and decrease the cost of replacement parts. Traditionally, IC product test is conducted through the socket pogo pin contact with IC pin or solder ball. Semiconductor test facility solves the oxidation of socket pogo pin, tin slag adhesion, adhesion of dust, and other problems by means of brushing it with a specific cleaning solution. Socket pogo pin is directly to be cleaned by brushing back and forth. This action will cause the gold-plated surface layer of socket pogo pin peeling off. The cleaning fluid flows into the load board along the socket pogo pin will damage the board. These phenomena decrease the life time of socket pogo pin and influence the yield of IC product test. In this study, YAG laser was used to clean the surface oxide, tin-slag, and powder layer of socket pogo pin. This noncontact cleaning method improves the testing yield, machine utilization and reduces the testing cost. Keywords：Overkill, socket pogo pin, YAG laser, yield.