Investigations on the Thermo-Mechanical Characteristics of Solder Joint with a Polymer Reinforced Wafer Level Package
碩士 === 明新科技大學 === 精密機電工程研究所 === 100 === In recent years, wafer level package is the most attention in the global IC packaging industry. It is more lightly, smaller, shorter, and more advantages than the multi-chip module, ball grid array and flip chip in the manufacturing processes and the material...
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| Format: | Others |
| Language: | zh-TW |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/21158872502604324330 |