Study on the Through-Glass-Via Formation by Photo-Chemical Etching for 3D IC Application
碩士 === 國立中興大學 === 光電工程研究所 === 100 === Integration of IC chips vertically, named 3-D integration, is an important technology direction to increase packing density, reduce route for signal propagation and hence increase the functionality and clock rate. Current technologies use through-silicon-via to...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/28202807730989381014 |