Study on the Through-Glass-Via Formation by Photo-Chemical Etching for 3D IC Application
碩士 === 國立中興大學 === 光電工程研究所 === 100 === Integration of IC chips vertically, named 3-D integration, is an important technology direction to increase packing density, reduce route for signal propagation and hence increase the functionality and clock rate. Current technologies use through-silicon-via to...
Main Authors: | Jui-Po Sun, 孫瑞伯 |
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Other Authors: | Zingway Pei |
Format: | Others |
Language: | zh-TW |
Published: |
2011
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Online Access: | http://ndltd.ncl.edu.tw/handle/28202807730989381014 |
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