The Interfacial Reaction on Pd-Coated Cu Wire Bonds Under Current Stressing
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 100 === The influence of palladium in the interfacial reactions of copper wire bonding under current stressing is reported in this study. At the as-bonded step, Pd dissolved into a Cu ball bond and then gathered at the edge of the Cu ball, forming an anti-oxidatio...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87407535661362624100 |