Study of Ultra-thin Seedless Cu Diffusion Barrier in Advanced Cu Metallization

博士 === 國立成功大學 === 微電子工程研究所碩博士班 === 100

Bibliographic Details
Main Authors: Kuo-ChungHsu, 許國忠
Other Authors: Dung-Ching Perng
Format: Others
Language:en_US
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/84452187920297981193