Simulation of Post Mold Cure Process in IC Packaging
碩士 === 國立成功大學 === 機械工程學系專班 === 100 === Because of the rapid development about semi-conductor integrated circuits, the products of computers, communication, and consumer electronics evolve day by day with tiny size, great performance, and more reliability. IC packaging components by E.M.C.(epoxy mold...
Main Authors: | , |
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Format: | Others |
Language: | zh-TW |
Published: |
2012
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Online Access: | http://ndltd.ncl.edu.tw/handle/36368803212944697774 |