Simulation of Post Mold Cure Process in IC Packaging
碩士 === 國立成功大學 === 機械工程學系專班 === 100 === Because of the rapid development about semi-conductor integrated circuits, the products of computers, communication, and consumer electronics evolve day by day with tiny size, great performance, and more reliability. IC packaging components by E.M.C.(epoxy mold...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36368803212944697774 |