Effect of Cooling Rate on the Microstructure Evolution of Sn-Ag-Cu Lead-Free Solder
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 100 === Effect of different cooling rates(0°C, 8°C, and 25°C water cooling experiments) on microstructural evolution of Sn-3.0Ag-0.5Cu(SAC305) and Sn-3.8Ag-0.7Cu(SAC387) lead-free solder were investigated. The influence of morphology it produced would be evaluated...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09481593251197970888 |