Nonlinear Viscoelastic Constitutive Model for Electronic Package Organic Substrate
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 100 === Organic substrate is a key constituent for connecting printed circuit board and silicon die in electronic packages. Package warpage typically occurs because of the thermal expansion mismatch among various packing constituents such as silicon die, molding comp...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69433933294136738391 |