Effect of different SnAg thickness on interfacial reactions in microbumps of Ni/SnAg/Cu
碩士 === 國立交通大學 === 材料科學與工程學系奈米科技碩博士班 === 100 === In this study, we study the metallurgical reaction in Cu/Sn2.3Ag/Ni sandwich structure. The under bump metallization (UBM) consists electroplated 20 μm-thick Cu with 100 μm diameter on one side. The other UBM is 125 μm Ni foil. The solder thicknes...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93028455847255921513 |