Metallurgical Reactions of Sn-2.5Ag Solder with ENIG /Cu/Ni and OSP /Cu Under Bump Metallization
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 100 === With the miniaturization of modern electronic products and devices, the packaging density of components such as chips significantly increases, and the scale of interconnections becomes smaller and smaller. Consequently, the reliability of solder joints p...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33806316448671267137 |