碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 100 === In this study, we investigated the EM effect on the joint interfaces of the Pb-free Sn(Cu) solder/ENEPIG solder joints at different annealing temperatures. The applied current density is 104 A/cm2. The compositions of Sn(Cu) solders joined with ENEPIG pad...

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Bibliographic Details
Main Authors: Shih-han Wu, 吳詩涵
Other Authors: Cheng-yi Liu
Format: Others
Published: 2012
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