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碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 100 === In this study, we investigated the EM effect on the joint interfaces of the Pb-free Sn(Cu) solder/ENEPIG solder joints at different annealing temperatures. The applied current density is 104 A/cm2. The compositions of Sn(Cu) solders joined with ENEPIG pad...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81969554091568696231 |