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• Main Authors: Shih-han Wu, 吳詩涵
• Other Authors: Cheng-yi Liu
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/81969554091568696231

碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 100 === In this study, we investigated the EM effect on the joint interfaces of the Pb-free Sn(Cu) solder/ENEPIG solder joints at different annealing temperatures. The applied current density is 104 A/cm2. The compositions of Sn(Cu) solders joined with ENEPIG pad are SnxCu (x=0.2,0.7,1). According to the preliminary results, a serious EM-induced Ni(P) consumption occurred. With increasing of the Cu content in the Sn(Cu) solders, the resistance to the EM-induced Ni(P) consumption wound be enhanced. In other words, the more Cu content in the Sn(Cu) solders, the less consumption of the ENEPIG pad. Also , we study the EM effect on the ENIG bond-pads joined with the same Sn(Cu) solder bumps at the same EM conditions. We found that, as compared to the previous Sn(Cu) ENEPIG results, the degree of the Ni(P) consumption is much serious and it also depends on the Cu content in the Sn(Cu) solder bumps.