Wafer Positioning by Laser Scanning Method
碩士 === 國立中央大學 === 光機電工程研究所 === 100 === A laser scanning method for wafer positioning is proposeed to determine the center position of the wafer in the cluster tool. This positioning system incorporates a laser scanning system and a scattering light receiving system. The scanner is used to reflect a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47296299533878827121 |