Saving golden thread in wire bonding process of the IC package by Taguchi Method
碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 100 === In the semiconductor packaging process, the wire bonding (Wire Bonding) IC packaging has been the best means of wire, so most of the IC packaging products using this process way. The wire arc parameter changes that affect product quality and cost is one...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49666755627717486087 |