Saving golden thread in wire bonding process of the IC package by Taguchi Method

• Main Authors: Chun-ming Huang, 黃俊明
• Other Authors: Rong Fong Fung
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/49666755627717486087

碩士 === 國立高雄第一科技大學 === 機械與自動化工程研究所 === 100 === In the semiconductor packaging process, the wire bonding (Wire Bonding) IC packaging has been the best means of wire, so most of the IC packaging products using this process way. The wire arc parameter changes that affect product quality and cost is one important factor, how the process factors do not affect the case and can save the consumption of gold is this paper is to explore the issues. This paper using the Taguchi method for the analysis of parameters, and then in accordance with the control factor and the standard of the number of values to select the most appropriate orthogonal array, and analysis of a group of the best lines arc parameters. In the case of factors does not affect the process, you can save each welding materials of a gold wire of 3mils above target.