Effect of Coated Material on Cu Wire Bonding in IC Package
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 100 === Wire bonding has been used in integrated circuit packaging for many decades because of its high reliability and performance. The most common metal used has been gold, but with the surge in commodity prices of gold in recent years, copper wire is now used to...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/45871998990617040362 |