Stacked Package MIMO Antenna and Isolator Design of MIMO Antenna

碩士 === 國立中山大學 === 通訊工程研究所 === 100 === This thesis is divided into two parts. In the first part, the antenna is integrated into the stacked package. The antenna and the semiconductor chip are co-designed together. We utilize the advantage of IPD manufacturing to develop strong capacitively coupled-fe...

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Bibliographic Details
Main Authors: Cheng-Han Lee, 李承翰
Other Authors: Ken-Hung Lin
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/83305925194891477734