Cost and time analysis of probe card configuration during fail die re-probing The Case Study of K Company

• Main Author: 黃武德
• Other Authors: 蘇哲平
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/41672271252394796287

碩士 === 國立清華大學 === 工業工程與工程管理學系碩士在職專班 === 100 === Semiconductor test manufacturing services，it is to distinguish IC is good or bad on wafer，the main function of the wafer testing to ensure the quality of wafer fabrication and reduce the cost of the package in assembly，provided best quality for the next process，the testing industry downstream of the semiconductor supply chain。Test equipment accounted for 70% of related costs，mainly expenditures for the test machine-TESTER and PROBER，another accessory expenditures for the build of the probe card，the build quantity is in multiples of the test machine，consumption costs are relatively high，The cost of implementation and use of management of the probe card, and how to effectively mix the test machine, and enhance cost control and productivity a major issue。 This article will explore of the analysis of defective items in the measured wafer testing with its cost，builded the” MAP simulation tool” and analysis reprobing cost to understand the benefits of the probe card，and the test machine made to reporbing differences in the cost，as well as improved，in addition，this article will also discussion whether to do reprobing this action。