Microstructure and Electrical Property of Copper Nanowires Fabricated by Pulsed Electrodeposition at Low Temperature
碩士 === 國立清華大學 === 材料科學工程學系 === 100 === Copper (Cu) metallization possesses good electrical conductivity and has been utilized as an interconnecting material in microelectronic devices. Besides, one-dimensional (1D) Cu nanostructures have received great attention due to their different physical prop...
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| Format: | Others |
| Language: | en_US |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/28963978618249585342 |