Effect of Pd Doping on Microstructure, Interfacial Reaction and Impact Reliability in Sn3.0Ag0.5Cu-xPd/Cu Solder Joints
碩士 === 國立清華大學 === 材料科學工程學系 === 100 === Rapid growth of intermetallic compounds (IMCs) and the formation of Kirkendall voids during solid reaction are critical issues for reliability of Cu-based solder joints. Adding minor 4th element into solder joints is proposed to improve the mechanical reliabili...
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29986195094120189253 |