Analysis and Design on the thermal Performance of a Desktop Computer and electronic Packaging.
碩士 === 國立臺灣海洋大學 === 機械與機電工程學系 === 100 === As the semiconductor manufacturing processes advance, the IC chips are getting more sophisticated and miniaturized. Ball grid array (BGA) and Flip Chip BGA (FC-BGA) have become the main-stream IC packaging technology due to better electric conductivity, more...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47459363910044323976 |