Analysis and Design on the thermal Performance of a Desktop Computer and electronic Packaging.
碩士 === 國立臺灣海洋大學 === 機械與機電工程學系 === 100 === As the semiconductor manufacturing processes advance, the IC chips are getting more sophisticated and miniaturized. Ball grid array (BGA) and Flip Chip BGA (FC-BGA) have become the main-stream IC packaging technology due to better electric conductivity, more...
Main Author: | 林冠甫 |
---|---|
Other Authors: | H.C. Tien |
Format: | Others |
Language: | zh-TW |
Published: |
2012
|
Online Access: | http://ndltd.ncl.edu.tw/handle/47459363910044323976 |
Similar Items
-
The Experimental Analysis of the Thermal Performance of Cooling Fans in Desktop Computer
by: 黎雅芸
Published: (2003) -
A Numerical Study on Thermal Analysis of Desktop Computer
by: Hsiu-Yu Lin, et al.
Published: (2002) -
The Performance Simulation and Analysis of Flat Heat Pipe Thermal Modules for Desktop Computer
by: Zhi-cheng Wang, et al.
Published: (2009) -
Application of the Ansys Electronics Desktop Software Package for Analysis of Claw-Pole Synchronous Motor
by: Sergey Gandzha, et al.
Published: (2019-10-01) -
A Parametric Study of Thermal Module for Desktop Computer
by: Chong-Yue Wang, et al.
Published: (2005)