The Study on Electromechanical Polishing of Cu Metal and Its Electrochemical Charateristics
碩士 === 國立臺灣大學 === 化學工程學研究所 === 100 === Unlike conventional chemical mechanical polishing (CMP), electrochemical mechanical polishing (ECMP) enables virtually zero downforce (< 0.5 psi), which can manage the weak mechanical strength of low-k dielectrics. In addition, in this new voltage-induced EC...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/89148495997501250745 |