The Study on Electrochemical Mechanical Polishing of Cu Metal Wire in Ammonium Phosphate System and Its Electrochemical Characteristics
碩士 === 國立臺灣大學 === 化學工程學研究所 === 100 === In this study, the electrochemical characteristics of Cu ECMP were investigated, and we also studied the best working condition during the process of Cu ECMP in ammonium phosphate slurry system. By performing electrochemical measurements such as polarization cu...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2012
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Online Access: | http://ndltd.ncl.edu.tw/handle/72788928073351100048 |