Manufacturing analysis and application of through silicon via (TSV) wafer
碩士 === 國立臺灣大學 === 機械工程學研究所 === 100 === With the development of high power LED, heat dissipation becomes a major issue of LED package. The traditional leaded package can no longer meet the demand for effective heat dissipating, so it is replaced by the SMT (surface-mount technology) with ceramic su...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/47018003395507361761 |