Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions
博士 === 國立臺灣大學 === 機械工程學研究所 === 100 === Considering the fatigue life of electronic packages under thermal-cyclic loading, the real test outcome reflects the fatigue life of an electronic package is, in fact, not deterministic but a random variable following a certain probability distribution. The...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05689228302549286616 |