Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions

博士 === 國立臺灣大學 === 機械工程學研究所 === 100 === Considering the fatigue life of electronic packages under thermal-cyclic loading, the real test outcome reflects the fatigue life of an electronic package is, in fact, not deterministic but a random variable following a certain probability distribution. The...

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Main Authors: Chih-Yen Su, 蘇志彥
Other Authors: 吳文方
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/05689228302549286616
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spelling ndltd-TW-100NTU054891332015-10-13T21:50:43Z http://ndltd.ncl.edu.tw/handle/05689228302549286616 Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions 加速環境狀態下覆晶晶片尺寸封裝體之機率設計與可靠度分析 Chih-Yen Su 蘇志彥 博士 國立臺灣大學 機械工程學研究所 100 Considering the fatigue life of electronic packages under thermal-cyclic loading, the real test outcome reflects the fatigue life of an electronic package is, in fact, not deterministic but a random variable following a certain probability distribution. The outcome has been paid attention to and become an important issue that needs to be investigated furthermore. Therefore, in the present study, a finite element analysis and a Monte Carlo simulation-based parametric study of a flip-chip chip scale package (FCCSP) subjected to thermal cyclic loading is carried out by using Probabilistic Design System (PDS) of ANSYS. In the first stage of the analysis, a few parameters involved in the package dimension, material property and life prediction formula are assumed to be random to account for their uncertainties. Moreover, to improve the accuracy of the probabilistic life distribution obtained from PDS, a refined probabilistic design procedure which includes probability paper and chi-square goodness-of-fit test is proposed in particular. In the second stage of the analysis, emphasis is placed on the confirmation of an acceleration model in which the accelerated thermal-cyclic tests are carried out numerically based on the analytical model established previously. The analytical result indicates that random geometric configuration, material property and random life prediction formula may cause fatigue life of the package to have scattered distribution as those observed from experiments. The result also indicates that PDS can indeed be employed to find the cumulative fatigue life distribution of the electronic package owing to parameter uncertainties, and the proposed refined procedure can further improve the smoothness of the cumulative fatigue life distribution curve and transform this curve into a closed form expression. Finally, a confirmed acceleration model can be used for the prediction of mean time to failure (MTTF), reliability and failure rate of the package under different thermal-cyclic conditions including the field or field-used one. 吳文方 2012 學位論文 ; thesis 96 zh-TW
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language zh-TW
format Others
sources NDLTD
description 博士 === 國立臺灣大學 === 機械工程學研究所 === 100 === Considering the fatigue life of electronic packages under thermal-cyclic loading, the real test outcome reflects the fatigue life of an electronic package is, in fact, not deterministic but a random variable following a certain probability distribution. The outcome has been paid attention to and become an important issue that needs to be investigated furthermore. Therefore, in the present study, a finite element analysis and a Monte Carlo simulation-based parametric study of a flip-chip chip scale package (FCCSP) subjected to thermal cyclic loading is carried out by using Probabilistic Design System (PDS) of ANSYS. In the first stage of the analysis, a few parameters involved in the package dimension, material property and life prediction formula are assumed to be random to account for their uncertainties. Moreover, to improve the accuracy of the probabilistic life distribution obtained from PDS, a refined probabilistic design procedure which includes probability paper and chi-square goodness-of-fit test is proposed in particular. In the second stage of the analysis, emphasis is placed on the confirmation of an acceleration model in which the accelerated thermal-cyclic tests are carried out numerically based on the analytical model established previously. The analytical result indicates that random geometric configuration, material property and random life prediction formula may cause fatigue life of the package to have scattered distribution as those observed from experiments. The result also indicates that PDS can indeed be employed to find the cumulative fatigue life distribution of the electronic package owing to parameter uncertainties, and the proposed refined procedure can further improve the smoothness of the cumulative fatigue life distribution curve and transform this curve into a closed form expression. Finally, a confirmed acceleration model can be used for the prediction of mean time to failure (MTTF), reliability and failure rate of the package under different thermal-cyclic conditions including the field or field-used one.
author2 吳文方
author_facet 吳文方
Chih-Yen Su
蘇志彥
author Chih-Yen Su
蘇志彥
spellingShingle Chih-Yen Su
蘇志彥
Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions
author_sort Chih-Yen Su
title Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions
title_short Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions
title_full Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions
title_fullStr Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions
title_full_unstemmed Probabilistic Design and Reliability Analysis of Flip-Chip Chip Scale Packages under Accelerated Environmental Conditions
title_sort probabilistic design and reliability analysis of flip-chip chip scale packages under accelerated environmental conditions
publishDate 2012
url http://ndltd.ncl.edu.tw/handle/05689228302549286616
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