Study of Taguchi & Grey Relational Analysis on LED Wire Bonding Parameter Optimization
碩士 === 國立臺灣科技大學 === 自動化及控制研究所 === 100 === Among LED package, wire bonding process is most popular method for electrical interconnection. During the boning process, bonding parameters are critical roles. This study is to use both the Gray relational analysis and Taguchi method analysis to find out th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34623376529053673115 |