| Summary: | 碩士 === 國立臺灣科技大學 === 自動化及控制研究所 === 100 === This study applied low temperature PEVCD (Plasma-Enhanced Chemical Vapor Deposition) in the preparation of SiOxNy film in OLED (Organic Light-Emitting Diode) encapsulation process to prevent the intrusion of water vapor and oxygen to prolong the light-emitting service life of OLED components. The high density ICP (Inductively-Coupled Plasma) was used to deposit films on the PES (Polyethersulfone), silicon and glass substrate. The correlation between the process parameters and the followings were discussed: 1) coating film uniformity; 2) coating film thickness; 3) WVTP. The process parameters under research included: 1) cavity temperature; 2) HMDSO (Hexamethyldisiloxane) flow; 3) Ar flow; 4) O2 flow; 5) NH3 flow; 6) coating film position height; 7) electro-plasma power; and 8) cavity pressure.This study used the orthogonal array of the Taguchi method of the single quality analysis to plan the experiments and conduct the coating process with the least experimental times. After the experiments, the variance analysis was conducted, and the S/N ratio was used to discuss the impact of various control factors on quality characteristics, in order to obtain the single optimization result. Next, using the ideal solution similarity degree order of preferenceapproach and grey relational analysis, this study determined the optimum level combinations before simulating and establishing the prediction system using the back propagation neural network and the Levenberg-Marquardt algorithm. Finally, the Taguchi method confirmation experiments and confidence level were used to calculate and verify the experimental results.After the multi-quality optimization design, the optimum WVTR (Water Vapor Transmission Rate) of the single layer film can be 0.02g/m2/day. The maximum coating film thickness could be up to 420nm, and the fasted speed could be up to 21nm/min, being higher than the industrial standard specifications by 110%. Meanwhile, the coating film uniformity error can be 2.9%.
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