Effects of minor Ru and N additions on thermal stability of sputtered Cu films
碩士 === 國立臺灣科技大學 === 材料科學與工程系 === 100 === Copper (Cu) has been widely used as the interconnect material due to its lower electrical resistivity and better electromigration resistance. However, its poor adhesion, detrimental reactions between Cu and Si as well as the diffusion of Cu into Si or SiO2 su...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59073755305062000850 |