On the fabrication and Characterization of flip-chip power light emitting diode with backside reflector
碩士 === 國立臺灣科技大學 === 電子工程系 === 100 === In this research, using thermo-sonic bonding technology, the chip LED and the sub-mount are bonded to produce a flip-chip power LED with high thermal conductivity Au bumps (291W/mK). The PLED usually exhibits an area of larger than 1mm2 , its power consumption i...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/39992380092109649112 |