Simulation and experimental study of fast hot embossing process

碩士 === 國立臺灣科技大學 === 機械工程系 === 100 === Micro/nano imprint technology is a commonly expected technique nowadays. It is very promising in the future because the technology has several advantages, such as having nano-scale resolution, forming three dimension structures and high throughput. This techno...

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Bibliographic Details
Main Authors: Lin Yun Wei, 林耘緯
Other Authors: Fuh-Yu Chang
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/48392861896709022029
Description
Summary:碩士 === 國立臺灣科技大學 === 機械工程系 === 100 === Micro/nano imprint technology is a commonly expected technique nowadays. It is very promising in the future because the technology has several advantages, such as having nano-scale resolution, forming three dimension structures and high throughput. This technology may be used to create the micro/nano structure for the next generation.However, a few steps of the whole process take a long time, including heating, pressing, and cooling. Only if the time for the process is reduced can the need for efficient mass-production be met. This is a study followed by previous research on “continuous sub-station synchronization process”, which is supplemented by a specially designed “holding pressure device”. In addition, this research also uses a theoretical simulation and improves the process and the parameters of the simulation results, so that it can shorten the time for the process. This study, based on the finite element method, uses commercial computational fluid dynamics software to create a 2D axis-symmetry model in order to simulate the filling behavior. Moreover, the Newtonian fluid is used to simplify the flowing pattern of the polymer materials in micro/nano imprint process, and the method of segmented isothermal is used to describe the non-isothermal process, so that the results of the present simulation can match with those of previous research. According to the results of the simulation along with another experiment added to it, when 150 Celsius degree is used as the transferring temperature and 105 Celsius degree is used as de-molding temperature, that filling rate can reach up to 94% and reduce half of the time spent in process (around 120 seconds), which can be helpful with the micro/nano imprint application in the future.