The Study of Flip Chip Packaging Technique on LEDs by Applying the Al-Ge Eutectic
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 100 === In this study, the fabricated of LED package module by MEMS technology. It uses Al-Ge alloy instead of Au-Sn alloy which is Flip-chip LED material of pattern module electrode package. Using the way of sputter and thermal evaporation, let Al-Ge alloy to grow...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34bz96 |