The Study of Flip Chip Packaging Technique on LEDs by Applying the Al-Ge Eutectic

• Main Authors: Guan-Xiang Liao, 廖冠翔
• Other Authors: Wen-Ray Chen
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/34bz96

碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 100 === In this study, the fabricated of LED package module by MEMS technology. It uses Al-Ge alloy instead of Au-Sn alloy which is Flip-chip LED material of pattern module electrode package. Using the way of sputter and thermal evaporation, let Al-Ge alloy to grows on the glass base with 450oC thermocompression. Moreover, using EDS,XRD and ect, as well, to analysis the percentage of the percentage of produces element, to confirm the percentage of element of invariant point and Al-Ge alloy is produce or not. Then, Al-Ge alloy used on LED packaging module, and compact with Au-Sn packaging module in terms of analysis of electrical measurements, and obtain the junction temperature by measurements, and then calculate the series resistance. Finally, comparison and analysis between Al-Ge alloy and Au-Sn alloy of the pros and cons.