Development of the LED Injecting Modules Based on the Thermal-Electric Separation

碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 100 === This study consists of the silicon and the copper materials to fabricate the LED lighting module used for the mini projector. The silicon substrate used throughout the experiment has a thickness of 275 μm. After the photolithography process, the silicon sub...

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Bibliographic Details
Main Authors: Pei-Chen Chen, 陳珮真
Other Authors: 謝振榆
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/2p3xz3