Development of the LED Injecting Modules Based on the Thermal-Electric Separation
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 100 === This study consists of the silicon and the copper materials to fabricate the LED lighting module used for the mini projector. The silicon substrate used throughout the experiment has a thickness of 275 μm. After the photolithography process, the silicon sub...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/2p3xz3 |