Development of the LED Injecting Modules Based on the Thermal-Electric Separation
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 100 === This study consists of the silicon and the copper materials to fabricate the LED lighting module used for the mini projector. The silicon substrate used throughout the experiment has a thickness of 275 μm. After the photolithography process, the silicon sub...
Main Authors: | Pei-Chen Chen, 陳珮真 |
---|---|
Other Authors: | 謝振榆 |
Format: | Others |
Language: | zh-TW |
Published: |
2012
|
Online Access: | http://ndltd.ncl.edu.tw/handle/2p3xz3 |
Similar Items
-
Thermal Analysis of LED Module
by: Shao-Yu Chen, et al.
Published: (2006) -
A Study of LED Optimum Thermal Module
by: Chen-Yu Chen, et al.
Published: (2007) -
Thermal Analysis of High Power LED Streetlight Module
by: Chen, Fu-Min, et al.
Published: (2009) -
Thermal Analysis of High Power LED Streetlight Module
by: Chen, Fu-Min, et al. -
Design of LED Direct-Lighting Backlight Module
by: Pei-Chen Wu, et al.
Published: (2007)