Effect of Minor Mg on the Various Properties of Sn-Cu Lead-Free Solder Alloys
碩士 === 國立虎尾科技大學 === 材料科學與綠色能源工程研究所 === 100 === The research was focused on the effects of Mg additions to Sn-0.7Cu lead-free solder on the melting point, microstructure, mechanical property, and joint performance. Results of differential scanning calorimeter analysis showed that alloying of Mg to Sn...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/sb7b2b |