A study on the structures and properties of low temperature wafer bonding
碩士 === 國立臺北科技大學 === 製造科技研究所 === 100 === Currently, the increase in development of electronic industry, minimization, multi-functions and low cost of an electronic product is the significant challenge to the semiconductor industry in two-dimensional integrated circuits (2DICs). As a result, three-dim...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/vj9235 |