The Study of the Blister on the FPC Connector
碩士 === 國立臺北科技大學 === 製造科技研究所 === 100 === This research is talking about the reason and solution of FPC (Flexible Print Circuit) connector’s surface blisters at a defect rate of 1.667%. These blisters occasionally can be found after the connector passes through IR reflow soldering, when soldering betw...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/dyhe63 |